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Vacuum-Brazed Copper Liquid Cooling Plate

Semiconductor

Vacuum-Brazed Copper Liquid Cooling Plate Hero 1

Project Brief

This customer sample showcases a finished copper liquid cooling plate produced through vacuum brazing. Copper is widely used in cooling components because of its excellent thermal conductivity, making it suitable for applications where efficient heat transfer and reliable thermal management are required.

Vacuum brazing provides a controlled heating environment that helps reduce oxidation and contamination during the joining process. For copper cooling plates, this is particularly important because the brazed joints need to provide both mechanical integrity and reliable sealing around the internal cooling channels.

Using a vacuum furnace, the brazing cycle can be precisely controlled according to the copper material, joint design, brazing alloy, and component dimensions. Proper temperature uniformity and process control help achieve consistent brazing quality across the assembly while reducing the risk of defects and distortion.

Normantherm vacuum furnaces can be customized according to component size, production requirements, and brazing process. For copper cooling plates and other heat-transfer components, the furnace can be configured to support controlled vacuum brazing and repeatable production results.

Application: Liquid cooling systems, thermal management components, heat exchangers, power electronics cooling, and other applications requiring efficient heat dissipation.

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